2023年6月26日发(作者:)
SPTS8R22 s
75V N-Channel MOSFET
General Features
Proprietary New Trench Technology
RDS(ON),typ.=17 m Ω@VGS=10V
Low Gate Charge Minimize Switching Loss
Fast Recovery Body Diode
HF Halogen Free
BVDSS
75V
RDS(ON),typ.
17mΩ
ID[2]
8A
Applications
High efficiency DC/DC Converters
Synchronous Rectification
UPS Inverter
Ordering Information
Part Number
SPTS8R22 s
Package
SOP-8
Brand
SOP-8
TC=25℃ unless otherwise specified
Absolute Maximum Ratings
Symbol
VDSS
VGSS
ID
IDM
PD
TL
TPAK
TJ& TSTG
Parameter
Drain-to-Source Voltage[1]
Gate-to-Source Voltage
Continuous Drain Current[2]
Pulsed Drain Current @VG=10V
Power Dissipation
Derating Factor above 25℃
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10
seconds, Package Body for 10 seconds
Operating and Storage Temperature Range
SPTS8R22 s
75
±20
8
32
3.1
0.4
300
260
-55 to 175
Unit
V
A
W
W/℃
℃
Caution: Stresses greater than those listed in the “Absolute Maximum Ratings” may cause permanent damage to the device.
Thermal Characteristics
Symbol
RθJC
RθJA
Parameter
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient
SPTS8R22 s
2.5
℃/W
100
Unit
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Semiconductors and may not be edited, reproduced, or redistributed in any way without written consent from PIP. Rev. A.2015
SPTS8R22 s
TJ =25℃ unless otherwise specified
Electrical Characteristics
OFF Characteristics
Symbol Parameter
BVDSS Drain-to-Source Breakdown Voltage
IDSS
IGSS
Drain-to-Source Leakage Current
Gate-to-Source Leakage Current
Min.
75
--
--
--
--
Typ. Max.
-- --
-- 5
--
--
--
100
+100
-100
Unit Test Conditions
V VGS=0V, ID=250uA
VDS=75V, VGS=0V
uA
VDS=60V, VGS=0V,
TJ =125℃
VGS=+20V, VDS=0V
nA
VGS=-20V, VDS=0V
ON Characteristics
Symbol
RDS(ON)
VGS(TH)
Min.
--
--
1.3
TJ =25℃ unless otherwise specified
Parameter
Static Drain-to-Source
On-Resistance
Gate Threshold Voltage
Typ. Max.
17 22
19 25
1.8 2.3
Unit
mΩ
V
Test Conditions
VGS=10V, ID=8A
VGS=4.5V, ID=8A
VDS=VGS, ID=250uA
Dynamic Characteristics
Symbol
Parameter
Ciss
Crss
Coss
Qg
Qgs
Qgd
Essentially independent of operating temperature
Min. Typ. Max.
1636
86
201
25
6.8
6.8
Unit
pF
Test Conditions
VGS=0V,
VDS=25V,
f=1.0MHZ
VDD=40V,
ID=8A, VGS=0 to 10V
Input Capacitance
Reverse Transfer Capacitance
Output Capacitance
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain (Miller) Charge
--
--
--
--
--
--
--
--
--
--
--
--
nC
Resistive Switching Characteristics
Symbol
Parameter
td(ON)
trise
td(OFF)
tfall
Turn-on Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Min.
11
50
39
36
Essentially independent of operating temperature
Typ. Max. Unit
Test Conditions
--
--
--
--
--
--
--
--
nS
VDD=40V,
ID=8A,
VGS= 10V
RG=1.0 Ω
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Semiconductors and may not be edited, reproduced, or redistributed in any way without written consent from PIP. Rev. A.2015
SPTS8R22 s
Parameter
Continuous Source Current[2]
Pulsed Source Current[2]
Diode Forward Voltage
Reverse recovery time
Reverse recovery charge
Min
--
--
--
--
--
Typ.
--
--
0.75
36
49
Max.
8[3]
32[2]
1.2
--
--
Unit
A
V
ns
nC
Test Conditions
Integral PN-diode
in
MOSFET
IS=8A, VGS=0V
VGS=0V ,IF=8A,
diF/dt=100A/μs
Source-Drain Body Diode Characteristics
TJ=25℃ unless otherwise specified
Symbol
ISD
ISM
VSD
trr
Qrr
Note:
[1] TJ=+25℃ to +175℃ .
[2] Silicon limited current only.
[3] Package limited current.
[4] Repetitive rating; pulse width limited by maximum junction temperature.
[5] Pulse width≤380µs; duty cycle≤2%.
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Semiconductors and may not be edited, reproduced, or redistributed in any way without written consent from PIP. Rev. A.2015
SPTS8R22 s
Test Circuits and Waveforms
Fig. 1.1 Peak Diode Recovery dv/dt Test Circuit
Fig. 1.2 Peak Diode Recovery dv/dt Waveforms
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Semiconductors and may not be edited, reproduced, or redistributed in any way without written consent from PIP. Rev. A.2015
SPTS8R22 s
Test Circuits and Waveforms
(Cont.)
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Semiconductors and may not be edited, reproduced, or redistributed in any way without written consent from PIP. Rev. A.2015
SPTS8R22 s
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