2024年4月16日发(作者：)

SMT常用术语中英文对照

SMT常用术语&中英文对照微組裝技術﹕MPT/Microelectronic

Packaging echnology

混裝技術﹕Mixed Component Mounting Technology

封裝﹕Package

貼片﹕Pick and Place

拆焊﹕Desoldering

再流﹕Reflow

浸焊﹕Dip Soldering

拖焊﹕Drag soldering

印制電路﹕Printed Circuit

印制線路﹕Printed Wiring

印制電路板﹕printed circuit board

印制線路板﹕printed wiring board

層壓板﹕laminate

覆铜銅薄层壓板﹕copper-clad laminate

基材﹕base material

成品板﹕production board

印刷﹕printing

導電圖形﹕conductive pattern

印制元件﹕printed component

單面印制板﹕single-sided printed board

雙面印制板﹕double-sided printed board

多層印制板﹕multilayer printed board

電烙鐵﹕Iron

熱風嘴﹕hot air reflowing noozle

吸錫帶﹕soldering wick

吸錫器﹕tin extractor

焊後檢驗﹕post-soldering inspection

目視檢驗﹕visual inspection

機器檢驗﹕machine inspection

焊點質量﹕soldering joint quality

焊電缺陷﹕soldering jont defect

錯焊﹕solder wrong

漏焊﹕solder skips

虛焊﹕pseudo soldering

冷焊﹕cold soldering

橋焊﹕solder bridge

脫焊﹕open soldering

焊點剝離﹕solder off

不潤濕焊點﹕soldering nonwetting

錫珠﹕solder ball

拉尖﹕icicle ；solder projection

孔洞﹕void

焊料爬越﹕solder wicking

過熱焊點﹕overheated solder connection

不飽和焊點﹕insufficient solder connection

過量焊點﹕excess solder connection

助焊劑剩余﹕flux residue

焊料裂紋﹕solder crazeing

焊角翹起﹕fillet-lifting ；lift-off

AI :Auto-Insertion 自動插件

AQL :acceptable quality level 允收水準

ATE :automatic test equipment 自動測試

ATM :atmosphere 氣壓

BGA :ball grid array 球形矩陣

CCD :charge coupled device 監視連接元件(攝影機)

CLCC :Ceramic leadless chip carrier 陶瓷引腳載具

COB :chip-on-board 晶片直接貼附在電路板上