2024年4月16日发(作者：)

PCB

PCB/ACCEPTANCE

IPC-DW-425A

IPC-TR-486

IPC-QE-605

IPC-OI-645

IPC-TF-870

IPC-ML-960

IPC-1710

IPC-6011

IPC-6012

IPC-6013

IPC-6015

IPC-6016

IPC-6018

IPC/JPCA-6202

IPC/JPCA-6801

IPC-9151

IPC-9191

IPC-9194

IPC-9199

IPC-9252

IPC-A-600

FABRICATION

IPC-DR-572

IPC-TA-724

IPC-4552

LAMINATE

Rigid

IPC-4101

IPC-4103

IPC-1730

Flex

IPC-FC-234

IPC-4202

IPC-4203

IPC-4204

IPC-4104

FOIL

IPC-CF-148

IPC-CF-152

IPC-1731

IPC-4562

REINFORCEMENT

IPC-4412

IPC-SG-141

IPC-A-142

IPC-QF-143

IPC-1731

IPC-4110

IPC-4121

IPC-4130

IPC-4411

4412A - Specification for Finished Fabric Woven from "E" Glass for Printed Boards

SG-141 - Specification for Finished Fabric Woven from "S" Glass for Printed Boards

A-142 - Specification for Finished Fabric Woven from Aramid for Printed Boards

QF-143 - Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards

1731 - Strategic Raw Materials Supplier Qualification Profile

4110 - Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed

Boards

4121 - Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications

4130 - Specification & Characterization Methods for Nonwoven "E" Glass Mat

4411A - Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

CF-148A - Resin Coated Metal for Printed Boards

CF-152B - Composite Metallic Materials Specification for Printed Wiring Boards

1731 - Strategic Raw Materials Supplier Qualification Profile

4562 - Metal Foil for Printed Wiring Applications with Amendment 1

FC-234 - PSA Assembly Guidelines for Single- & Double-Sided Flexible Printed Circuits

4202 - Flexible Base Dielectrics for Use in Flexible Printed Circuitry

4203 - Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible

Adhesive Bonding Films

4204 - Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

4104 - Specification for High Density Interconnect (HDI) and Microvia Materials

4101B - Specification for Base Materials for Rigid and Multilayer Printed Boards

4103 - Specification for Base Materials for High Speed/High Frequency Applications

1730A - Laminator Qualification Profile

DR-572 - Drilling Guidelines for Printed Boards

TA-724 - Technology Assessment Series on Clean Rooms

4552 - Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards

DW-425A - Design and End Product Requirements for Discrete Wiring Boards

TR-486 - Report on Round Robin Study to Correlate IST & Microsectioning Evaluations for Detecting the

Presence of Inner-Layer Separation

QE-605A - Printed Board Quality Evaluation Handbook

OI-645 - Standard for Visual Optical Inspection Aids

TF-870 - Qualification and Performance of Polymer Thick Film Printed Boards

ML-960 - Qualification and Performance Specification for Mass Lamination Panels for Multilayer Printed

Boards

1710A - OEM Standard for Printed Board Manufacturer's Qualification Profile (MQP)

6011 - Generic Performance Specification for Printed Boards

6012B - Qualification and Performance Specification for Rigid Printed Boards

6013A - Qualification and Performance Specification for Flexible Printed Boards

6015 - Qualification & Performance Specification for Organic Multichip Module Mounting and

Interconnecting Structures

6016 - Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards

6018A - Microwave End Product Board Inspection and Test

6202 - IPC/JPCA Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards

6801 - IPC/JPCA Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density

Interconnect (HDI) Printed Wiring Boards

9151A - Printed Board Process, Capability, Quality and Relative Reliability (PCQR

2

) Benchmark Test

Standard and Database

9191 - General Guidelines for Implementation of Statistical Process Control (SPC)

9194 - Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly

Manufacture Guideline

9199 - Statistical Process Control (SPC) Quality Rating

9252 - Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards

A-600G - Acceptability of Printed Boards

PCB

DW-425A - 散线印制板的设计及最终产品要求

TR-486 - 内层分离的互联应力测试(IST)与显微剖切相关性联合研究报告

QE-605A - 印制板质量评估手册

OI-645 - 人工光学法检查标准

TF-870 - 聚合物厚膜印制板规范及性能指标

ML-960 - 多层印制板预制内层覆箔板性能规范与指标

1710A - OEM规定的印制板制造商资格规范

6011 - 印制板通用性能技术指标

6012B - 刚性印制板的规范及技术指标

6013A - 揉性印制板的规范及技术指标

6015 - 有机多芯片模块(MCM-L)组装及互连结构规范及技术指标

6016 - 高密度互联多层板性能及技术指标

6018A - 微波成品印制板的检验和测试.

6202 - 单双面挠性印制板性能手册

6801 - 积层/高密互联印制线路板术语、定义、测试方法和设计范例

9151A -印制板工艺、生产能力、质量和相关可靠性基准测试标准扩数据库

9191 - 实施统计过程控制(SPC)的通用规则

9194 -实施印制板装配制造指南中的统计过程控制(SPC)通用导则

9199 - 统计过程控制中的质量评定

9252 - 裸板电气测试要求和规则

A-600G - 印制板的验收条件

DR-572 - 印制板钻孔指南

TA-724 - 关于清洗室技术评定等级

4552 - 印制电路板表面无电镀镍/沉金规范.

4101B - 刚性及多层印制板基材规范

4103 - 适用于高速/高频范围的基材规范

1730A - 层合机生产商资格规范

FC-234 - PSA 单双面揉性印制电路板装配指南

4202 - 揉性印制线路用挠性绝缘基底材料

4203 - 挠性印制线路覆盖层用涂粘接剂绝缘薄膜

4204 - 揉性印制电路板表面复盖层粘胶涂层绝缘薄膜以及揉性粘胶粘合膜

4104 -高密度(HDI)互连微通孔技术纲要

CF-148A - 印制板树脂复模金属

CF-152B - 印制线路板复合金属材料规范

1731 - - 战略原材料供应商资格条件及目录

4562 - 印制线路用金属箔

4412A - “E”精纺玻璃纤维层印制板技术规范

SG-141 - “S”精纺玻璃纤维层印制板技术规范

A-142 - “芳香族聚酰胺”印制板技术规范

QF-143 -“石英（纯熔凝硅石）纺织纤维层印制板技术规范

1731 - 战略原材料供应商资格规范及目录

4110 - 无纺纤维纸印制板技术规范及性能确定方法

4121 - 多层印制线路板芯材结构选择应用指南

4130 - 无纺"E"形玻璃纤维板的规范及特性方法.

4411A - 无纺“芳纶”增强纤维的规范及特性方法