2024年4月16日发(作者：)

覆桐版制印刷电路化学方程式

英文回答：

Conductive copper plating is a fundamental process in

the production of printed circuit boards (PCBs). The

electroless copper plating process is widely employed due

to its simplicity, cost-effectiveness, and ability to

create uniform and conformal copper layers on complex

substrates. The chemical equations involved in the

electroless copper plating process can be described as

follows:

Activation:

Cu2+ + Sn2+ → Cu + Sn4+。

Pd2+ + Sn2+ → Pd + Sn4+。

Catalysis:

Pd + 2HCHO → Pd(HCHO)2。

Pd(HCHO)2 + 4OH→ Pd(HCOO)22+ 2H2O + 2HCHO.

Copper Deposition:

Cu2+ + 2Pd(HCOO)22+ 4OH→ Cu + 2Pd(HCOO)24+ 2H2O.

These chemical reactions work synergistically to

achieve electroless copper plating. The activation step

prepares the substrate surface by reducing copper ions to

form a thin layer of copper atoms. The catalysis step

generates palladium ions, which act as catalysts for the

copper deposition reaction. Finally, the copper deposition

reaction reduces copper ions to form a continuous copper

layer on the substrate.

中文回答：

覆铜板制印刷电路化学方程式。

导电铜电镀是印刷电路板 (PCB) 生产中的基本工艺。化学镀铜

工艺因其简单、成本效益高以及能够在复杂基材上创建均匀保形的

铜层而被广泛采用。化学镀铜工艺中涉及的化学方程式可以描述如

下：

活化：

Cu2+ + Sn2+ → Cu + Sn4+。

Pd2+ + Sn2+ → Pd + Sn4+。

催化：

Pd + 2HCHO → Pd(HCHO)2。

Pd(HCHO)2 + 4OH→ Pd(HCOO)22+ 2H2O + 2HCHO.

镀铜：

Cu2+ + 2Pd(HCOO)22+ 4OH→ Cu + 2Pd(HCOO)24+ 2H2O.

这些化学反应协同作用，实现化学镀铜。活化步骤通过将铜离

子还原形成一层薄的铜原子来制备基材表面。催化步骤产生钯离子，

钯离子作为镀铜反应的催化剂。最后，镀铜反应将铜离子还原，在

基材上形成连续的铜层。