2024年4月16日发(作者：)
专利内容由知识产权出版社提供
专利名称：Coupon board and manufacturing method
of printed circuit board
发明人：Sugimoto, Kaoru,Kobayashi, Katsuhiko
申请号：EP10170538.2
申请日：20100722
公开号：EP2280590A1
公开日：20110202
专利附图：
摘要：A coupon board (30) is cut out together with a printed wiring board (20) from a
sheet material (10) in which a solder resist film is formed on a surface of a glass cloth
fiber. The coupon board (30) is for evaluating characteristics of the printed wiring board.
The coupon board (30) includes a region (31) on which the solder resist film is not formed,
and which extends parallel with one side of the printed wiring board (20).
申请人：Fujitsu Limited
地址：1-1, Kamikodanaka 4-chome Nakahara-ku Kawasaki-shi, Kanagawa 211-8588 JP
国籍：JP
代理机构：Wilding, Frances Ward
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