2024年4月16日发(作者：)

ACCEPTANCE

IPC-DRM-40

IPC-A-610

IPC-9191

IPC-DRM-SMT

POSTERS

A-610D - Acceptability of Electronic Assemblies

9191 - General Guidelines for Implementation of Statistical Process Control

(SPC)

DRM-SMT-D - BOOK: Surface Mount Solder Joint Evaluation Training &

Reference Guide

ASSEMBLY

J-STD-001

IPC-HDBK-001

IPC-9261

IPC-7912

J-STD-001D - Requirements for Soldered Electrical and Electronic

Assemblies

HDBK-001 - IPC-HDBK-001 with Amendments 1 and 2 - Handbook and

Guide to Supplement J-STD-001 (Includes J-STD-001 B-C-D Comparisons)

9261 - In-Process DPMO and Estimated Yield for PWAs

7912A - End-Item DPMO for Printed Circuit Board Assemblies

ASSEMBLY SUPPORT

SMC-WP-002

IPC-DRM-18

IPC-DW-426

IPC-TR-581

IPC-TA-722

IPC-TA-723

IPC-CM-770

IPC-SM-780

IPC-SM-785

IPC-S-816

IPC-AJ-820

IPC-TP-1115

IPC-1720

IPC-7095

IPC-7525

IPC-7530

IPC-7711 7721

IPC-9701

IPC/JEDEC-9702

IPC-9850

IPC-9851

DRM-18G - BOOK: Component Identification Training & Reference Guide

DW-426 - Specification for Assembly of Discrete Wiring

TR-581 - IPC Phase III Controlled Atmosphere Soldering Study

TA-722 - Technology Assessment Handbook on Soldering

TA-723 - Technology Assessment Handbook on Surface Mounting

CM-770E - Component Mounting Guidelines for Printed Boards

SM-780 - Component Packaging and Interconnecting with Emphasis on

Surface Mounting

SM-785 - Guidelines for Accelerated Reliability Testing of Surface Mount

Attachments

S-816 - SMT Process Guideline & Checklist

AJ-820 - Assembly & Joining Handbook

TP-1115 - Selection and Implementation Strategy for A Low-Residue No-

Clean Process

1720A - Assembly Qualification Profile

7095A - Design and Assembly Process Implementation for BGAs

7525 - Stencil Design Guidelines

7530 - Guidelines for Temperature Profiling for Mass Soldering (Reflow &

Wave) Processes

7711/21A - Rework and Repair Guide

9701A - Performance Test Methods and Qualification Requirements for

Surface Mount Solder Attachments

9702 - IPC/JEDEC Monotonic Bend Characterization of Board-Level

Interconnects

9850-K - Surface Mount Placement Equipment Characterization - KIT

IPC-1066

1066 - Marking, Symbols and Labels for Identification of Lead-Free and

Other Reportable Materials in Lead-Free Assemblies, Components and

Devices

SOLDERABILITY

IPC-WP-001

J-STD-002

J-STD-003

IPC-WP-005

IPC-TR-461

IPC-TR-462

IPC-TR-464

IPC-TR-465-1

IPC-TR-465-2

IPC-TR-465-3

IPC-TR-466

IT-WP-001 - Myths of E-Commerce

J-STD-002B - Solderability Tests for Component Leads, Terminations, Lugs,

Terminals and Wires

J-STD-003A - Solderability Tests for Printed Boards

WP-005 - PWB Surface Finishes

TR-461 - Solderability Evaluation of Thick & Thin Fused Coatings

TR-462 - Solderability Evaluation of Printed Boards with Protective

Coatings Over Long-Term Storage

TR-464 - Accelerated Aging for Solderability Evaluations

TR-465-1 - Round Robin Test on Steam Ager Temperature Control Stability

TR-465-2 - The Effect of Steam Aging Time and Temperature on

Solderability Test Results

TR-465-3 - Evaluation of Steam Aging on Alternative Finishes, Phase 11A

TR-466 - Technical Report: Wetting Balance Standard Weight Comparison

Test

ADVANCED

IPC-TR-001

IPC-WP-003

J-STD-012

J-STD-013

J-STD-026

J-STD-028

IPC-SM-784

IPC-MC-790

TR-001 - An Introduction to Tape Automated Bonding Fine Pitch

Technology

WP-003 - Chip Mounting Technology

J-STD-012 - Implementation of Flip Chip and Chip Scale Technology

J-STD-013 - Implementation of Ball Grid Array & Other High Density

Technology

J-STD-026 - Semiconductor Design Standard for Flip Chip Applications

J-STD-028 - Performance Standard for Construction of Flip Chip and Chip

Scale Bumps

SM-784 - Guidelines for Chip-on-Board Technology Implementation

MC-790 - Guidelines for Multichip Module Technology Utilization

CABLE AND WIRE HARNESS

IPC-DRM-56

DRM-56 - BOOK: Wire Preparation & Crimping Desk Reference Manual

IPC-WHMA-A-620

A-620A - Requirements and Acceptance for Cable and Wire Harness

Assemblies

OPTOELECTRONICS

IPC-0040

IPC-8413-1

8413-1 - Specification for Process Carriers Used to Handle Optical Fibers in

Manufacturing

电子组件的可接受标准

SPC实施的通用指导方针

表面贴装组件焊点评估培训与参考指导

电子与电气组件焊接要求

J-STD-001D标准学员手册与指导，包含对J-STD-001B，C，D

版本的比较

组装过程中百万分之不良率和评价机率

印制线路板组装中最终产品的百万分之不良率

元件识别培训与参考指导

分立导线组装的规格说明

IPC关于第三种在焊接中，被控制使用的气体的研究

焊接技术评估手册

表面贴装技术评估手册

印制板上元件贴装的指导

表面贴装上元件封装和互联的重点

表面贴装组件在增加可靠性测试方面的指导

SMT制程指导与检查表

组件与（焊点)连接手册

一个低残留免清洗制程选择与实施的战略

组件认证方案

BGA设计装配工艺执行条例

模板设计指南

批量焊接（回流与波峰）制程温度曲线的指导

返工与修理指南

表面贴装焊接安装表现测试方法和资格条件

板面水平连接的单调弯折特性

表面贴装设备特性描述

在无铅组件，元件和设备中，无铅和其它需报告的材料的标

记，符号和标签

电子商务法

元件引脚，终端，把手，末端和导线的可焊性

印制线路板可焊性测试

印制线路板表面处理

厚与薄保护涂层的可焊性评估

涂覆上保护涂层的印制板经过长期存储后的可焊性性评估

加快老化的可焊性评估

蒸汽老化温度控制稳定性循环试验

蒸汽老化时间和温度在可焊性测试结果上的影响

几种表面涂层在蒸汽老化后的评估

技术报告：润湿平衡标准重量比较测试

带型自动贴装细间距器件技术介绍

片式元件贴装技术

倒装芯片与芯片级技术实施

BGA和其它高密度元件技术的实现

半导体设计标准中倒装芯片的应用

倒装芯片与芯片级结构碰撞表现标准

板上连接式芯片技术实施指南

多层芯片模组技术使用指南

导线准备与剥线便携手册

电缆、线束装配的技术条件及验收要求

生产过程中处理光纤的工艺运载工具规范