2024年4月16日发(作者：)

印 制 电 路 板（Printed Circuit Boards）

IPC-M-105

IPC-D-325A

IPC-PE-740A

IPC-6010 Series

IPC-6011

IPC-6013-K

IPC-6016

IPC-6012A-AM

IPC-6018A

IPC-6015

IPC-A-600F

IPC-QE-605A

IPC-QE-605A-KIT

Rigid Printed Board Manual

刚性印制板设计手册

Documentation Requirements for Printed

Boards 印制板设计文件图册要求

Troubleshooting for Printed Board

Manufacture and Assembly

印制板制造和组装的故障排除

IPC-6010 Qualification and Performance

Series

IPC-6010印制电路板质量标准和性能规范系列

手册

Generic Performance Specification for

Printed Boards

印制板通用性能规范

Qualification & Performance Specification

for Flexible Printed Boards (Includes

Amendment 1) 挠性印制板的鉴定与性能规范（包

括修改单1）

Qualification & Performance Specification

for High Density Interconnect (HDI) Layers

or Boards

高密度互连(HDI)层或印制板的鉴定与性能规范

Qualification and Performance Specification

for Rigid Printed Boards, Includes Amendment

1 刚性印制板的鉴定与性能规范 (包括修改单

1)

Microwave End Product Board Inspection and

Tech

微波成品印制板的检验和测试

Qualification & Performance Specification

for Organic Multichip Module (MCM-L)

Mounting and Interconnections

有机多芯片模块(MCM-L)安装及互连结构的鉴定

与性能规范

Acceptability of Printed Boards

印制板验收条件

Printed Board Quality Evaluation Handbook

印制板质量评价

Hard Copy and CD

印制板质量评价书和光盘(CD)

IPC-HM-860

IPC-TF-870

IPC-ML-960

IPC-TR-481

IPC-TR-551

IPC-TR-579

IPC-4552

IPC-DR-572

IT-95080

IPC-NC-349

IPC-SM-839

IPC-HDI-1

IPC/JPCA-4104

IPC-6016

Specification for Multilayer Hybrid

Circuits

多层混合电路规范

Qualification and Performance of Polymer

Thick Film Printed Boards

聚合物厚膜印制板的鉴定与性能

Qualification and Performance Specification

for Mass Lamination Panels for Multilayer

printed Boards

多层印制板的鉴定与性能规范用预制内层在制

板的鉴定与性能规范

Results of Multilayer Tests Program Round

Robin

多层印制板联合试验计划结果

Quality Assessment of Printed Boards Used

for Mounting and Interconnecting Electronic

Components

用于电子元件安装与互连的印制板质量评价

Round Robin Reliability Evaluation of Small

Diameter Plated Through Holes in PCBs

印制板中小直径镀覆孔可靠性评价联合试验

Specification for Electroless

Nickel/Immersion Gold(ENIG) Plating for

Printed Circuit Boards

印制电路板表面非电镀镍/沉金规范

Drilling Guidelines for Printed Boards

印制板钻孔导则

Improvements/Alternatives to Mechanical

Drilling of PCB Vias

印制板通孔机加工方案的改进和优选手册

Computer Numerical Control Formatting for

Drillers and Routers

钻床和铣床用计算机数字控制格式

Pre & Post Solder Mask Application Cleaning

Guidelines

施加阻焊前及施加后清洗导则

High Density Interconnect Microvia

Technology Compendium

高密度(HDI)互连微通孔技术纲要

Specification for High Density Interconnect

(HDI) and Microvia Materials

高密度互连(HDI)及微导通孔材料规范

Qualification & Performance Specification

for High Density Interconnect (HDI) Layers