2024年4月11日发(作者：)

专利内容由知识产权出版社提供

专利名称：METHOD FOR CUTTING MOTHER GLASS

SUBSTRATE FOR DISPLAY AND BRITTLE

MATERIAL SUBSTRATE AND METHOD FOR

MANUFACTURING DISPLAY

发明人：KAMEI, Masayuki,NAKAYAMA,

Masayuki,SHAMOTO, Hideyasu

申请号：JP2009005192

申请日：20091006

公开号：WO10/044217P1

公开日：20100422

摘要：Provided is a method for cutting a mother glass substrate (1) of a display panel

which includes a first glass substrate (G1) and a second glass substrate (G2) bonded by

sealing members (5) that define multiple cells arranged in a matrix. In a first step, a

scribe line is formed on the first glass substrate (G1) by disposing a predetermined

machining line (L1) in a gap between the sealing members (5) of adjacent cells and

irradiating the first glass substrate (G1) with a laser along the predetermined machining

line (L1). In a second step, the second glass substrate (G2) is cleaved by irradiating the

second glass substrate (G2) with a laser along the predetermined machining line (L1) and

cooling the neighborhood of a region (40) irradiated with the laser. Stress generated

when the second glass substrate (G2) is cleaved is transmitted to the first glass substrate

(G1) via the sealing members (5), whereby the first glass substrate (G1) is cleaved along

the scribe line substantially simultaneously with the cleavage of the second glass

substrate (G2).

申请人：KAMEI, Masayuki,NAKAYAMA, Masayuki,SHAMOTO, Hideyasu

地址：JP,JP,JP,JP

国籍：JP,JP,JP,JP

代理人：MORISHITA, Sakaki

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