2024年4月11日发(作者：)
专利内容由知识产权出版社提供
专利名称：Rigid-flex wiring board and method for
producing same
发明人：Katsuo Kawaguchi,Hirofumi
Futamura,Yukinobu Mikado,Sotaru Ito
申请号：US10558289
申请日：20050523
公开号：US2A1
公开日：20070118
专利附图：
摘要：In a flex-rigid wiring board in which a rigid substrate formed from a rigid base
material and a flexible substrate formed from a flexible base material are stack-joined
and electrically connected to each other, the flexible substrate including a conductive
layer having interconnecting electrode pads provided on at least one surface thereof,
and the rigid substrate including a conductive layer having interconnecting electrode
pads provided on at least one surface thereof in a position opposite to the
interconnecting electrode pads on the rigid substrate, are locally connected electrically
to each other with an anisotropic conductive adhesive layer interposed between
conductive layers of substrate portions each including at least the interconnecting
electrode pads. In this flex-rigid wiring board, transmission of high-frequency signals can
be prevented from being delayed, noises can be suppressed, and an excellent electrical
connection and connection reliability be assured.
申请人：Katsuo Kawaguchi,Hirofumi Futamura,Yukinobu Mikado,Sotaru Ito
地址：Gifu JP,Gifu JP,Gifu JP,Gifu JP
国籍：JP,JP,JP,JP
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