2024年4月11日发(作者：)

dba陶瓷基板工艺流程

English Answer：

DBA Ceramic Substrate Manufacturing Process.

The DBA ceramic substrate manufacturing process

involves several key steps, including:

1. Substrate Preparation: The process begins with the

preparation of the ceramic substrate, which involves

grinding and polishing to achieve the desired surface

finish and dimensions.

2. Paste Application: A dielectric paste, composed of

ceramic powders and organic binders, is applied to the

substrate using a screen printing or doctor blade technique.

3. Drying: The paste is then dried to remove the

organic binders and consolidate the ceramic particles.

4. Sintering: The substrate is fired at high

temperatures (typically 1200-1600°C) to densify the

ceramic and form a strong and durable bond between the

paste and the substrate.

5. Metallization: A thin layer of metal, such as

copper or silver, is deposited on the surface of the

substrate to provide electrical conductivity.

6. Patterning: The metal layer is patterned using

photolithography or laser ablation to create the desired

circuit layout.

7. Etching: The exposed ceramic areas are etched away

using a chemical or laser process to define the circuit

traces.

8. Plating: Additional layers of metal are plated onto

the circuit traces to enhance conductivity and provide

protection against corrosion.

9. Inspection and Testing: The completed substrate

undergoes rigorous inspection and testing to ensure

electrical performance and reliability.

Chinese Answer：

DBA 陶瓷基板工艺流程。

DBA 陶瓷基板制造工艺涉及以下几个关键步骤：

1. 基板制备， 该工艺以基板制备为开始，其中包括研磨和抛

光，以获得所需的表面光洁度和尺寸。

2. 浆料涂覆， 使用丝网印刷或刮刀技术将由陶瓷粉末和有机

粘结剂组成的介电浆料涂覆在基板上。

3. 干燥， 然后干燥浆料以去除有机粘结剂并固化陶瓷颗粒。

4. 烧结， 在高温（通常为 1200-1600°C）下烧制基板，以使

陶瓷致密化并在浆料和基板之间形成牢固且耐用的粘合。

5. 金属化， 在基板表面沉积一层薄金属，例如铜或银，以提

供导电性。

6. 图案化， 使用光刻或激光烧蚀对金属层进行图案化，以创

建所需的电路布局。

7. 蚀刻， 使用化学或激光工艺蚀刻掉暴露的陶瓷区域，以定

义电路走线。

8. 电镀， 在电路走线上电镀额外的金属层，以增强导电性和

提供防腐蚀保护。

9. 检查和测试， 已完成的基板经过严格的检查和测试，以确

保电气性能和可靠性。