2024年5月16日发(作者：红米note7pro屏幕刷新率)

该法案将为美国半导体研发、制造以及劳动力发展提供527亿美元。

其中390亿美元将用于半导体制造业的激励措施，20亿美元用于汽

车和国防系统使用的传统芯片。此外，在美国建立芯片工厂的企业将

获得25%的减税。

拜登在法案签字仪式上说，尽管美国的芯片设计和研发保持领

先，但全球只有10%的半导体是在美国本土生产。新冠疫情导致的供

应链中断，推高了美国家庭和个人的成本。“我们需要在美国本土制

造这些芯片，以降低日常成本，创造就业机会。”

拜登表示，这项法案将为美国整个半导体供应链提供资金，促进

芯片产业用于研究和开发的关键投入。该法案要求任何接受美国政府

资金的芯片企业必须在美国本土制造他们研发的技术。这意味着“在

美国投资，在美国研发，在美国制造”。

CHIPSandScienceActof2022

Sec.101—Shorttitle.

ThisActmaybecitedasthe“CHIPSActof2022.”

Sec.102—Creatinghelpfulincentivestoproducesemiconductors(CHIPS)for

Americafund.

Inordertosupporttherapidimplementationofthesemiconductorprovisions

includedintheFiscalYear

(“FY”)2021NationalDefenseAuthorizationAct(“NDAA”),thisdivisionwould

provide$52.7billionin

guagewouldalsore-affirmthatthe

purchaseofstocks

anddividendsarenotaneligibleuseofCHIPSfundsasdeterminedbytheeligible

useoffundsalready

requiredundertheFY21NDAA.

Fundedactivitiesinclude:

$gmustbe

usedto

implementtheCommerceDepartmentsemiconductorincentive—todevelop

domestic

manufacturingcapability—andresearchanddevelopment(“R&D”)andworkforce

development

programsauthorizedbytheFY21NDAA(Sec.9902&9906).Eachfiscalyear,upto2

percentof

fundsaremadeavailableforsalariesandexpenses,administration,andoversight,of

which$5

millionisavailableeachyearfortheinspectorgeneral.

Withinthefund,thefollowingappropriationsareavailable:

oIncentiveProgram:$39billionallocatedover5yearstoimplementtheprograms

authorizedinSec.9902,ofwhich$2billionisexplicitlyprovidedtofocussolelyon

le

chips

areessentialtotheautoindustry,themilitary,

the

incentiveprogram,upto$6billionmaybeusedforthecostofdirectloansandloan

guarantees.

$19billioninFY22,includingthe$2billionlegacychipproductionfunding.

$5billioneachyear,FY23throughFY26

oCommerceR&Dandworkforcedevelopmentprograms:$11billionappropriated

over5

yearstoimplementprogramsauthorizedinSec.9906,includingtheNational

SemiconductorTechnologyCenter(“NSTC”),theNationalAdvancedPackaging

ManufacturingProgram,andotherR&Dandworkforcedevelopmentprograms

authorizedinSec.9906.

$5billioninFY22

$2billionforNSTC

$2.5billionforadvancedpackaging

$500millionforotherrelatedR&Dprograms

ForuseacrosstheNSTC,advancedpackaging,andotherrelatedR&Dprograms,

thefollowingwouldbeprovided:

$2billioninFY23

$1.3billioninFY24

$1.1billioninFY25

$1.6billioninFY26

$2billionforaCHIPSforAmericaDefenseFund:Fundingwouldbeappropriated

forthe

MicroelectronicsCommons,anationalnetworkforonshore,university-based

prototyping,lab-tofabtransitionofsemiconductortechnologies—including

DepartmentofDefense-unique

applications—andsemiconductorworkforcetraining.