HUSB330_E-Marker芯片|江阴雨辰互联

2024年3月14日发(作者：网上买的随身wifi靠谱吗)

USB Type-C线缆电子标签芯片

Hynetek Semiconductor Co, Ltd

功能

支持USB Type-C 1.2 和 PD 2.0/3.0 标准

通过USB-IF认证. TID号: 1000060, XID号: 0005396

支持SOP’ 通讯

集成收发单元 (BMC PHY)

同时支持structured VDM version 1.0 和 2.0

高集成度

集成两端的Ra电阻

集成两端的VCONN二极管

集成 MTP

小封装和易加工:

DFN-8L 2 mm x 3 mm x 0.75 mm, 0.50 mm管间距

DFN-6L 2 mm x 2 mm x 0.75 mm, 0.65 mm 管间距

可选多次烧写或者单次烧写

兼容第三方烧写工具

支持 3.0 V ~ 5.5 V的VCON1 和VCON2引脚供电

定制化CC引脚烧写

BMC信号斜率控制减少EMI

±5 kV ESD HBM

HUSB330

应用

USB Type-C线缆

通用描述

HUSB330是USB Type-C电子标签芯片。它同时

支持USB Type-C规范1.2，USB USB Power Delivery

规范 2.0 和USB USB Power Delivery 规范 3.0.

通过VCON1或者VCON2供电，HUSB330工作

在SOP’模式. 自带的多次烧写存储单元（MTP）可支

持多次反复烧写或者单次烧写。HUSB330也可以支持

通过CC引脚实现Type-C成品头或者成品线缆系统烧

写。

HUSB330支持3.0 V 到 5.5 V范围，与USB-IF最

新支持的VCONN供电规范一致。HUSB330有两种封

装形式：DFN-8L和DFN-6L. 它工作在-40°C 到+85°C

温度范围。

典型应用电路

VBUS

HUSB330

VCON1SCL

VCON2

EPAD

GND

0.1uF0.1uF

GND

USB TYPE-C PLUG

SDA

GND

VBUS

VCONN

USB TYPE-C PLUG

图

330

典型应用电路

Rev1.1, 5/12/2017

HUSB330

Contents

DATA SHEET

功能 ................................................................................................................................................................................... 1

应用 ................................................................................................................................................................................... 1

通用描述 ............................................................................................................................................................................ 1

典型应用电路 ..................................................................................................................................................................... 1

规格指标 ............................................................................................................................................................................ 3

普通规格指标 ................................................................................................................................................................. 3

绝对最大值 ..................................................................................................................................................................... 4

热阻 ................................................................................................................................................................................ 4

ESD 警告........................................................................................................................................................................ 4

引脚定义和功能描述 .......................................................................................................................................................... 5

系统框图 ............................................................................................................................................................................ 6

应用信息 ............................................................................................................................................................................ 7

Discover Identity命令 .................................................................................................................................................... 7

VDO 数据 ....................................................................................................................................................................... 7

烧写系统 ............................................................................................................................................................................ 9

封装尺寸 ..........................................................................................................................................................................10

订购指南 .......................................................................................................................................................................10

DATA SHEET

HUSB330

规格指标

普通规格指标

测试条件V

= 5 V, T

= 25°C, 除非特别说明.

表 1.

参数

GENERAL PARAMETERS

VCON1/VCON2 Voltage

Under-voltage Lockout

Operating Junction Temperature

Operating Ambient Temperature

BMC COMMON PARAMETERS

Bit Rate

BMC TX PARAMETERS

Maximum Difference between the Bit-rate

during the Part of the Packet Following the

Preamble and the Reference Bit-rate.

Time to Cease Driving the Line after the And

of the Last bit of the Frame.

Fall Time

Time to cease driving the line after the final

high-to-low transition.

Time from the End of Last Bit of a Frame until

the Start of the First bit of the Next

Preamble.

Rise Time

Time Before the Start of the First Bit of the

Preamble when the Transmitter shall Start

Driving the Line.

Voltage Swing

Transmit Low Voltage

Transmitter Output Impedance

BMC RX PARAMETERS

Power Cable Termination

Time Window for Detecting Bus Non-idle

Number to Count to Detect Bus Non-idle

Time constant of a single pole filter to limit

broad-band noise ingression

Receiver Input Impedance

符号

DD_UVLO

BitRate

EndDriveBMC

Fall

HoldLowBMC

InterFrameGap

Rise

StartDrive

Swing

Driver

TransitionWindow

Count

RxFilter

BmcRx

测试条件

最小值

3.0

-40

270

300

-1

1.05

-75

800

100

典型值

2.8

300

1.125

最大值

5.5

125

330

0.25

1.2

1200

单位

°C

Kbps

µs

Ω

µs

MΩ

HUSB330

绝对最大值

表 2.

参数

VCON1, VCON2 and CC to GND

NC Pins to GND

Storage Temperature Range

Operating Junction Temperature

Range

ESD HBM (Human Body Model)

ESD MM (Machine Model)

Soldering Conditions

等级

−0.5 V to +7 V

−0.5 V to +3.6 V

−65°C to +150°C

−40°C to +125°C

±5 kV

200 V

JEDEC J-STD-020

DATA SHEET

热阻

is specified for the worst-case conditions, that is, a

device soldered in a circuit board for surface-mount

packages.

表3. 热阻

封装类型

DFN-8L

DFN-6L

31.5

45.5

7.5

11.7

单位

°C/W

ESD 警告

DATA SHEET

HUSB330

引脚定义和功能描述

VCON1

VCON2

GND

SCL

VCON1

VCON2

SCL

SDA

GND

SDA

DFN-8L 2 mm x 3 mm

DFN-6L 2 mm x 2 mm

图

引脚定义

顶视图

表 4. 引脚功能描述

DFN-8

引脚

DFN-6

引脚

N/A

引脚

名称

VCON1

VCON2

GND

SDA

SCL

EPAD

VCONN电源供电引脚。

Type-C CC 线输入和输出引脚。

另一端电源供电引脚。

芯片地。

内部调试引脚，建议连接到地。

没有内部连接，建议连接到地。

热焊盘。

引脚描述

DATA SHEET

HUSB330

系统框图

VCON1

VOLTAGE

REGULATOR

DETECTION

VCON2

RARA

USB PD

PHISICAL LAYER

PROTOCAL

LAYER

INTERNAL BUS

MTP

BANK

I2C

ENGINE

SDA

SCL

GND

图

3. HUSB330

系统框图

DATA SHEET

HUSB330

应用信息

DISCOVER IDENTITY命令

详细的Discover Identity命令参见USB Power Delivery Specification Revision 3.0, Version 1.1。

由E-Marker发送的Discover Identity命令应包含一个ID Header VDO, 一个 Cert Stat VDO, 一个 Product VDO。

Product VDO的产品类型的定义如图 4所示。

图

4. Discover Identify

命令的响应

VDO 数据

表 5. VDO 定义

Bit(s)

[31]

Field

Data Capable as USB Host

Descriptions

USB Communications Capable as USB Host:

• Shall be set to one if the product is capable of enumerating USB

Devices.

• Shall be set to zero otherwise

USB Communications Capable as a USB Device:

• Shall be set to one if the product is capable of being enumerated as a

USB Device.

• Shall be set to zero otherwise

Product Type (Cable Plug):

• 000b – Undefined

• 001b..010b – Reserved, shall not be used.

• 011b – Passive Cable

• 100b – Active Cable

• 101b..111b – Reserved, shall not be used.

Modal Operation Supported:

• Shall be set to one if the product supports Modal Operation.

• Shall be set to zero otherwise

Product Type (DFP):

• 000b – Undefined

• 001b – PDUSB Hub

• 010b – PDUSB Host

• 011b – Power Brick

• 100b - Alternate Mode Controller (AMC)

• 101b..111b – Reserved, shall not be used.

USB-IF assigned VID

Assigned by USB-IF

ID Header VDO

[30] Data Capable as USB Device

[29:27] Product Type Cable Plug

[26]

[25:23]

Modal Operation Supported

Product type (DFP)

[22:16] Reserved

[15:0] 16-bit unsigned integer. USB vendor ID

Cert Stat VDO

[31:0] 32-bit unsigned integer, XID

Product VDO

[31:16]

[15:0]

16-bit unsigned integer. USB Product ID

16-bit unsigned integer .bcdDevices

Product ID assigned by Cable Vendor

Device Version assigned by Cable Vendor

Passive Cable VDO

[31:28]

[27:24]

[23:21]

HW Version

Firmware Version

VDO Version

0000b..1111b assigned by the VID owner

Version Number of the VDO (not this specification Version):

• Version 1.0 = 000b

Values 001b..111b are Reserved and shall not be used

Shall be set to zero. [20] Reserved

DATA SHEET

[19:18] Type-C to USB Type-A/Type-B/Type-

C/Captive

Reserved

Cable Latency

HUSB330

00: reserved

01: reserved

10: Type-C

11: Captive

0000b – Reserved, shall not be used

0001b – <10ns (~1m)

0010b – 10ns to 20ns (~2m)

0011b – 20ns to 30ns (~3m)

0100b – 30ns to 40ns (~4m)

0101b – 40ns to 50ns (~5m)

0110b – 50ns to 60ns (~6m)

0111b – 60ns to 70ns (~7m)

1000b –1000ns (~100m)

1001b –2000ns (~200m)

1010b – 3000ns (~300m)

1011b ….1111b Reserved, shall not be used

Includes latency of electronics in Active Cable

00b = VCONN not required. Cable Plugs that only support Discover

Identity Commands shall set these bits to 00b.

01b = VCONN required

10b..11b = Reserved, shall not be used

Maximum Cable VBUS Voltage:

00b – 20V

01b – 30V

10b – 40V

11b – 50V

Shall be set to zero.

00b = Reserved, shall not be used.

01b = 3A

10b = 5A

11b = Reserved, shall not be used.

0 = No

1 = Yes

Shall be set to 0.

000b = USB 2.0 only, no SuperSpeed support

001b = [USB 3.1] Gen1

010b = [USB 3.1] Gen1 and Gen2

011b.. 111b = Reserved, shall not be used

See [USB Type-C 1.2] for definitions.

[17]

[16:13]

[12:11] Cable Termination Type

[10:9] Maximum VBUS Voltage

[8:7]

[6:5]

Reserved

VBUS Current Handling Capability

[4]

[3]

[2:0]

VBUS Through Cable

Reserved.

USB SuperSpeed Signaling support

DATA SHEET

HUSB330

烧写系统

GUI

Type-B

Receptacle

TYPE-C PD

PHY

USB-C

Receptacle

HUSB330WTR

Type-C Plug

HUSB330

(SOP’)

Type-C CABLE

图

5. HUSB330WTR

烧写工具

Type-C Plug

HUSB330 DATA SHEET

封装尺寸

图

6. DFN-8L

封装

, 2 mm × 3 mm

图

7. DFN-6L

封装

, 2 mm × 2 mm

订购指南

订货型号

HUSB330DN8

HUSB330DN6

HUSB330WTR

环境温度范围

−40°C to +85°C

封装描述

DFN-8L

DFN-6L

HUSB330 烧录器

包装形式

Tape & Reel, 3000

HUSB330

IMPORTANT NOTICE

DATA SHEET

Hynetek Semiconductor Co., Ltd. and its subsidiaries (Hynetek) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue.

Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All

semiconductor products (also referred to herein as “components”) are sold subject to Hynetek’s terms and conditions of sale supplied at the time of

order acknowledgment.

Hynetek warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in Hynetek’s

terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent Hynetek deems

necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

Hynetek assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

applications using Hynetek components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate

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