2024年4月16日发(作者：)
专利内容由知识产权出版社提供
专利名称：Underfill film for printed wiring assemblies
发明人：Janice Danvir,Katherine Devanie,Nadia Yala
申请号：US10356419
申请日：20030131
公开号：US2A1
公开日：20040805
专利附图：
摘要：A self supported underfill film () adhesively bonds surface mount integrated
circuit packages () to a printed circuit board (). The printed circuit board has conductive
traces () and exposed conductive pads () on the surface. A film adhesive is strategically
positioned on the printed circuit board near the conductive pads, and the surface mount
integrated circuit package is then placed on the board so that the conductive pads () on
the package align with the conductive pads on the board. The film adhesive softens when
the package is soldered to the board, and the film ultimately serves as an underfill to
increase the mechanical integrity of the solder joints.
申请人：DANVIR JANICE,DEVANIE KATHERINE,YALA NADIA
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