2024年4月11日发(作者：)
wbbga封装流程详解
英文回答：
WBBGA Encapsulation Process.
The WBBGA encapsulation process is a complex and
precise process that involves several steps:
1. Substrate Preparation: The first step is to prepare
the substrate, which is typically a silicon wafer. The
substrate is cleaned and coated with a thin layer of metal,
which will serve as the electrical connection between the
die and the package.
2. Die Attach: The next step is to attach the die to
the substrate using a die attach adhesive. The adhesive is
applied to the substrate and the die is placed on top. The
assembly is then heated and pressed to secure the die in
place.
3. Wire Bonding: Once the die is attached, the next
step is to wire bond the die to the substrate. This
involves using thin gold wires to connect the electrical
terminals on the die to the corresponding terminals on the
substrate.
4. Encapsulation: The next step is to encapsulate the
assembly in a protective material. This is typically done
using a mold compound, which is a liquid that is dispensed
around the assembly and then cured to form a solid.
5. Soldering: The next step is to solder the assembly
to the circuit board. This involves applying solder to the
terminals of the package and then heating the assembly to
melt the solder and form a connection.
6. Testing: The final step is to test the assembly to
ensure that it is functioning properly. This involves
performing a series of electrical tests to check for any
defects or errors.
中文回答：
WBBGA封装流程详解。
WBBGA封装流程是一个复杂而精密的工艺，涉及多个步骤：
1. 基板制备，第一步是制备基板，通常是硅晶片。基板被清洗
并涂上薄金属层，该金属层将作为芯片和封装之间的电气连接。
2. 芯片贴装，下一步是使用贴片胶将芯片贴装到基板上。将胶
水涂抹到基板上，然后将芯片放置在上面。然后将组件加热并加压，
以将芯片固定到位。
3. 引线键合，芯片贴装后，下一步是将芯片键合到基板上。这
需要使用细金线将芯片上的电气端子连接到基板上相应的端子上。
4. 封装，下一步是将组件封装在保护性材料中。这通常使用模
具化合物完成，模具化合物是一种围绕组件分配的液体，然后固化
以形成固体。
5. 焊接，下一步是将组件焊接在电路板上。这需要在封装端子
上施加焊料，然后加热组件熔化焊料并形成连接。
6. 测试，最后一步是测试组件以确保其正常工作。这包括执行
一系列电气测试以检查是否存在任何缺陷或错误。
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