2024年4月11日发(作者：)

cowos rdl工艺流程

英文回答：

Cowos RDL Process Flow.

The cowos RDL process flow is a complex and multi-step

process that involves the following steps:

1. Substrate Preparation: The first step in the cowos

RDL process is to prepare the substrate. This involves

cleaning the substrate and removing any contaminants. The

substrate is then coated with a thin layer of metal,

typically copper or aluminum.

2. Photolithography: The next step is to create a

pattern on the substrate using photolithography. This

involves exposing the substrate to ultraviolet light

through a mask, which creates a pattern of exposed and

unexposed areas on the substrate.

3. Etching: The exposed areas of the substrate are then

etched away, leaving behind a pattern of metal lines and

spaces.

4. Electroplating: The metal lines are then

electroplated with a thicker layer of metal, typically

copper or gold.

5. Dielectric Deposition: A dielectric layer is then

deposited on the metal lines. This layer insulates the

metal lines from each other and prevents electrical shorts.

6. Via Formation: Vias are then formed through the

dielectric layer to connect the metal lines on different

layers.

7. Metal Fill: The vias are then filled with metal,

typically copper or gold.

8. Planarization: The surface of the substrate is then

planarized to create a smooth surface.

9. Final Metallization: A final layer of metal is then

deposited on the substrate to protect the underlying layers

from corrosion.

中文回答：

COWOS RDL工艺流程。

COWOS RDL工艺流程是一个复杂的多步骤工艺，涉及以下步骤：

1. 基板制备，COWOS RDL工艺的第一步是制备基板。这包括清

洗基板并去除任何污染物。然后用一层薄金属（通常是铜或铝）涂

覆基板。

2. 光刻，下一步是使用光刻技术在基板上创建图案。这涉及通

过掩模将基板暴露在紫外线下，从而在基板上 داجیا曝光和未曝光区

域的模式。

3. 蚀刻，然后蚀刻掉基板的曝光区域，留下金属线和空间的图

案。

4. 电镀，然后用一层较厚的金属（通常是铜或金）对金属线进

行电镀。

5. 介质沉积，然后在金属线上沉积一层介质层。该层使金属线

相互绝缘并防止电气短路。

6.

线。

7.

8.

9.

蚀。

通孔形成，然后通过介质层形成通孔以连接不同层上的金属

金属填充，然后用金属（通常是铜或金）填充通孔。

平坦化，然后平坦化基板表面以创建平滑表面。

最终金属化，最后在基板上沉积一层金属以保护底层免受腐